Over-Moulding of Electronic Assemblies
Low-Pressure Moulding is used to encapsulate and protect electronic products, or components against moisture, dust, dirt, and vibration. In most cases the Over-Moulding forms the enclosure for the product – meaning our clients receive their products fully assembled and ready to use.
Synapco specialises in the Over-Moulding of electronic assemblies, including PCBs, sensors and other sensitive components. The Over-Moulding process provides a totally sealed and encapsulated product, which is a cost-effective alternative to conventional encapsulation or potting and offers instant protection from moisture, vibration and other challenging environmental conditions.
The Low-Pressure Moulding process was first developed for the automotive industry to replace the toxic and cumbersome potting (2 part resin casting) process, achieving faster cycle times, lighter weight parts and meeting the environmental concerns for safer industry products. The key to successful Low-Pressure Moulding is material selection. Low viscosity resins are used as moulding compounds to achieve the very low injection pressures, which are essential when Over-Moulding electronic components. The moulding material must also be able to bond to the components and form a barrier to the environment. Synapco has material available in Black or Amber and ranging from 75 – 95 Shore A hardness.
Low-Pressure Moulding guarantees a uniform product, free from the usual casting defects associated with potting, whilst offering a greater range of material properties. The Low Moulding temperatures do not harm the electronics and will not re-melt or re-flow the solder in any way. At Synapco we have developed our own innovative low-cost tooling system and moulding machine, which makes it possible to economically Over-Mould large circuit boards with very complex multiple connectors. Other than printed circuit boards, Low-Pressure Moulding is also commonly used for sealing connectors, moulding grommets, and adding strain reliefs to cables. Wherever you need to seal and protect an electronic device there is an opportunity to use Low-Pressure Moulding as your solution.
For further information, take a look at our Over-Moulding case study: